Conference Committee

Committees

Honorary Chairs

  • Sheng Liu, Wuhan University, China
  • Jun Hu, University of Electronic Science and Technology of China, China

Technical Program Committee

(Alphabetical Order by Last Name）

  • Ye Ai, Singapore University of Technology and Design, Singapore
  • Xinxia Cai, Aerospace Information Research Institute, Chinese Academy of Sciences, China
  • Lingqian Chang, Beihang University, China
  • Xiangyu Chen, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
  • Jian Chen, Aerospace Information Research Institute, Chinese Academy of Sciences, China
  • Haotian Chen, The University of Glasgow, United Kingdom
  • Huanyu Cheng, The Pennsylvania State University, USA
  • Lip Ket Chin, The Hong Kong Polytechnic University, China
  • Fan Dong, University of Electronic Science and Technology of China, China
  • Lei Dong, Southeast University, China
  • Huigao Duan, Hunan University, China
  • Zhongwei Fan, University of Chinese Academy of Sciences, China
  • Jinchi Han, Peking University, China
  • Mengdi Han, Peking University, China
  • Jian He, North University of China, China
  • Han Wei Ho, Nanyang Technological University, Singapore
  • Megan Yi-Ping Ho, The Chinese University of Hong Kong, China
  • Hongjie Hu, Peking University, China
  • Chengguo Hu, Chongqing University, China
  • Weida Hu, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, China
  • Huan Hu, Zhejiang University, China
  • Yongan Huang, Huazhong University of Science and Technology, China
  • Yonggang Jiang, Beihang University, China
  • Jin-Woo Kim, University of Arkansas, USA
  • Chengkuo Lee, National University of Singapore, Singapore
  • Hui Li, Southern Illinois University Carbondale, USA
  • King Ho Holden Li, Nanyang Technological University, Singapore
  • Xinxin Li, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
  • Longqiu Li, Harbin Institute of Technology, China
  • Wen Jung Li, City University of Hong Kong, China
  • Tie Li, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, China
  • Zhou Li, Tsinghua University, China
  • Xinqin Liao, Xiamen University, China
  • Lianqing Liu, Shenyang Institute of Automation, Chinese Academy of Sciences, China
  • Xinyu Liu, Dalian University of Technology, China
  • Ming Liu, Xi'an Jiaotong University, China
  • Xia Liu, Beijing Institute of Technology, China
  • Junshan Liu, Dalian University of Technology, China
  • Yipeng Lu, Peking University, China
  • Geyu Lu, Jilin University, China
  • Yanchao Mao, Zhengzhou University, China
  • Bo Meng, Shenzhen University, China
  • Xiaojing Mu, Chongqing University, China
  • Pavel Neuzil, Northwestern Polytechnical University, China
  • Tingrui Pan, University of Science and Technology of China, China
  • Caofeng Pan, Beihang University, China
  • Lijia Pan, Nanjing University, China
  • Bei Peng, University of Electronic Science and Technology of China, China
  • Linmao Qian, Southwest Jiaotong University, China
  • Tianling Ren, Tsinghua University, China
  • Jinyou Shao, Xi'an Jiaotong University, China
  • Yi Shi, Nanjing University, China
  • Young Min Song, Gwangju Institute of Science and Technology, South Korea
  • Huiling Tai, University of Electronic Science and Technology of China, China
  • Roland Tay, Nanyang Technological University, Singapore
  • Lili Wang, Institute of Semiconductors, Chinese Academy of Sciences, China
  • Yifan Wang, Nanyang Technological University, Singapore
  • Wei Wang, Peking University, China
  • Junbo Wang, Aerospace Information Research Institute, Chinese Academy of Sciences, China
  • Yuelin Wang, Shaoxing University, China
  • Zegao Wang, Sichuan University, China
  • Renxin Wang, North University of China, China
  • Xueyong Wei, Xi'an Jiaotong University, China
  • Liaoyong Wen, Westlake University, China
  • Zhen Wen, Soochow University, China
  • Wengang Wu, Peking University, China
  • Guoqiang Wu, Wuhan University, China
  • Juan Xia, University of Electronic Science and Technology of China, China
  • Huikai Xie, Beijing Institute of Technology, China
  • Sheng Xu, University of California San Diego, USA
  • Sixing Xu, Hunan University, China
  • Chenyang Xue, Laoshan National Laboratory, China
  • Zhuoqing Yang, Shanghai Jiao Tong University, China
  • Yongliang Yang, Shenyang Institute of Automation, Chinese Academy of Sciences, China
  • Weiqing Yang, Southwest Jiaotong University, China
  • Guang Yao, University of Electronic Science and Technology of China, China
  • John Yeow, University of Waterloo, Canada
  • Hua Yu, Chongqing University, China
  • Xinge Yu, City University of Hong Kong, China
  • Weizheng Yuan, Northwestern Polytechnical University, China
  • Jiachen Zhang, City University of Hong Kong, China
  • Wanli Zhang, University of Electronic Science and Technology of China, China
  • Ting Zhang, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, China
  • Chi Zhang, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
  • Haixia Zhang, Peking University, China
  • Libo Zhao, Xi'an Jiaotong University, China
  • Yuliang Zhao, Northeastern University, China
  • Wei Zhou, Xiamen University, China
  • Yu Zhou, Central South University, China
  • Peng Zhou, Fudan University, China
  • Jian Zhou, Hunan University, China
  • Xudong Zou, Aerospace Information Research Institute, Chinese Academy of Sciences, China
  • Quan Zou, University of Electronic Science and Technology of China, China

General Chair

  • Xiaosheng Zhang, University of Electronic Science and Technology of China, China

General Co-Chairs

  • Yuan Lin, University of Electronic Science and Technology of China, China
  • Zenghui Wang, University of Electronic Science and Technology of China, China
  • Juergen Brugger, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

Local Organizing Committee Chairs

  • Yi Zhang, University of Electronic Science and Technology of China, China
  • Zhuqing Wang, Sichuan University, China
  • Beomjoon Kim, The University of Tokyo, Japan

Technical Program Committee Chairs

  • Wei Tang, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
  • Yu Song, City University of Hong Kong, China
  • Taisong Pan, University of Electronic Science and Technology of China, China

Invited Session Organizing Committee Chairs

(Alphabetical Order by Last Name）

  • Tianxun Gong, University of Electronic Science and Technology of China, China
  • Jian He, North University of China, China
  • Huan Hu, Zhejiang University, China
  • Xinqin Liao, Xiamen University, China
  • Xia Liu, Beijing Institute of Technology, China
  • Bo Meng, Shenzhen University, China
  • Xiaojing Mou, Chongqing University, China
  • Cheng Tu, University of Electronic Science and Technology of China, China
  • Zegao Wang, Sichuan University, China
  • Lili Wang, Institute of Semiconductors, Chinese Academy of Sciences, China
  • Yan Wang, University of Electronic Science and Technology of China, China
  • Renxin Wang, North University of China, China
  • Liaoyong Wen, Westlake University, China
  • Cao Xia, Sichuan University, China
  • Juan Xia, University of Electronic Science and Technology of China, China
  • Bo Xu, University of Electronic Science and Technology of China, China
  • Guang Yao, University of Electronic Science and Technology of China, China
  • Chi Zhang, Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, China
  • Yu Zhou, Central South University, China
  • Jiankai Zhu, University of Electronic Science and Technology of China, China

Publication Commitee Co-chairs

  • Cheng Tu, University of Electronic Science and Technology of China, China
  • Haitao Zhao, Northwestern Polytechnical University, China
  • Cao Xia, Sichuan University, China